Event Detail
Lamination of Thin Web for Packaging
August 18, 2010
- Philadelphia NJ UNITED STATES
Seminars for Engineers
This two-day seminar will give engineers a comprehensive understanding of lamination processes and how they are applicable to flexible packaging. Lamination can often provide a better result for flexible packaging than monolayer materials can and is a very important technique to understand. Concepts covered will include wetting and its impact on adhesion; extrusion vs. adhesive lamination; rationale for lamination; bond testing; bond failure mechanisms; and alternatives to laminating.